Aluminum Nitride Offers High Thermal Conductivity, Higher Electric Insulation, and Smaller Dielectric Constant Required in Numerous Applications in Automotive Industry, Chemical Industry, and Other Industries
Aluminum nitride (AN), a hard, lightweight, ductile, and wear-resistant compound, is used as a carrier for many of the components of a microchip. Its several benefits include high density, mechanical strength, electrical and mechanical properties, and high creep resistance. AN is a fine powder made from aluminum oxide, oxygen, and nitrogen. It is a very dense, non-precious metal that is commonly mixed with other elements for the production of finished products such as glass, plastic, and polyester. It is resistant to corrosion by water, air, and chemicals, but not by heat, moisture, or light. AN substrates also offer high thermal conductivity, higher electric insulation, smaller dielectric constant, higher mechanical strength, and superior corrosion resistance against molten metal. Such properties have led to the development of new AN substrates. For instance, in April 2020, HexaTech Inc., a manufacturer and distributor of semiconductor devices based in the U.S., launched its deep-UV transparent 2-diameter, single-crystal aluminum nitride (AlN) substrate product line.
This material has numerous applications in the heating industry, automotive industry, chemical industry, power industry, aerospace, and semiconductor industry. This unique and advanced technical ceramic material has many advantages over other commonly used materials, and its high level of thermal conductivity makes it the most excellent option for many diverse uses.
Because of these properties, many have sought to use aluminum nitride for various applications. For high temperatures, especially involving the electronics industry, this material is becoming an increasingly popular component in electronics due to its inherent strengths. Although it resists high temperatures of up to 500 degrees Fahrenheit, it does not deteriorate nor deform even in such extreme temperatures. It also is very lightweight, which enables its use in brazing applications, as well as many other applications including piezoelectricity, ultrasound, and phase transfer. It is also used in the manufacturing of solid-state electronics such as computer chips and optoelectronic devices.
One of the physical properties of aluminum nitride that lends itself to various applications is its high thermal conductivity. It has an overall higher thermal energy than most alloys including diamond and hence can be used in many microwave applications. Its thermal conductivity is based on its unique three-dimensional electronic structure, which includes a honeycomb lattice and numerous crystal phases. The electronic structure makes this material different from the bulk metallic conductive materials. In addition, the large number of crystal phases results in a distinct "grain structure", which results in an increased overall optical bandwidth.
Because of its unique physical properties, aluminum nitride has many advantages when it comes to use in thermal insulation and high temperatures. It is the ideal material for insulating metals because it possesses high thermal conductivities and low thermal expansion. Another advantage it possesses is its low electrical insulation. As a result, it is able to maintain a uniform temperature outwards, which means it may be used to insulate components that are placed close to one another. It is also good for use in building structures because its high electrical insulation property prevents the formation of vapor bubbles under the component's surfaces, which leads to the formation of leaks. This also prevents corrosion of the metal.
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